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| Academic Studies | |
| 01/2009 - | Postgraduate Student in the IGP H-C3 at Technische Universität Berlin
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| 10/2003 - 12/2008 | Studies on Electrical Engineering at Technischen Universität Berlin
Degree: Diplom
Main focus on Microsystem-Technologies, Digital Mobile Communications and Medical Electronics
Diploma Thesis: Untersuchung elektrischer Verbindungen im Gigahertz-Bereich zur Zustandsüberwachung von Mikrosystemen
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| Professional Experience | |
| 10/2007 - 12/2008 |
Student Assistant at BeCAP/TU Berlin, Department Environmental Engineering |
| 10/2005 - 09/2007 |
Tutor at TU-Berlin; Department Halbleiterbauelemente |
| Awards |
CPMT Student Travel Award (2009) |
| Research Interests |
Reliability and Condition Indication of Electronic Systems |
| Measurement of Micrometer Scale Cracks in Electronic Interconnections |
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| Work Group |
Berlin Center of Advanced Packaging |
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| Advisors |
Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl |
| Prof. Dr.-Ing. Christian Boit |
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| Publications |
"Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines" Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N. F.; Reichl, H. ECTC2009 (www.ectc.net) |
